مرکز منطقه ای اطلاع رساني علوم و فناوري - Single Point Outer Mad Bonding Technology For High Pin Count Ceramic PGA

DocumentCode :

2760085

Title :

Single Point Outer Mad Bonding Technology For High Pin Count Ceramic PGA

Author :

Ando, Tetsuo ; Tomioka, Taizo ; Nakaz, Masakazu ; Atsumi, Ono Koichiro ; Tane, Yasuo ; Nakano, Jiro ; Hirata, Seiichi

fYear :

1993

fDate :

9-11 Jun 1993

Firstpage :

183

Lastpage :

186

Keywords :

Bonding forces; Ceramics; Conducting materials; Copper; Electrodes; Electronics packaging; Gold; Lead; Nickel; Temperature;

fLanguage :

English

Publisher :

ieee

Conference_Titel :

Electronic Manufacturing Technology Symposium, 1993., Proceedings of 1993 Japan International

Print_ISBN :

0-7803-1432-8

Type :

conf

DOI :

10.1109/IEMT.1993.639747

Filename :

639747

Link To Document :