DocumentCode
2760086
Title
Flip-chip bonded stacked patch antenna for Monolithic Microwave Integrated Circuits
Author
Elmezughi, A.S. ; Rowe, W.S.T.
Author_Institution
RMIT Univ., Melbourne
fYear
2006
fDate
12-15 Dec. 2006
Firstpage
689
Lastpage
692
Abstract
This paper presents the design and simulation of a stacked patch antenna with a proximity coupled feed realized via a flip-chip bonding process. The antenna uses high and low dielectric constant materials and is compatible to Monolithic Microwave Integrated Circuits. The antenna achieves a bandwidth of 23.8% (VSWR < 2) centered at frequency of 13 GHz and has a gain of 5.3 dBi.
Keywords
MMIC; antenna feeds; dielectric materials; flip-chip devices; microstrip antennas; microwave antennas; dielectric materials; flip-chip bonded stacked patch antenna; frequency 13 GHz; monolithic microwave integrated circuits; proximity coupled feed; Bonding processes; Circuit simulation; Coupling circuits; Feeds; High-K gate dielectrics; MMICs; Microwave antennas; Microwave integrated circuits; Monolithic integrated circuits; Patch antennas; Flip-chip bonding; microstrip antennas; millimeter-waves; proximity coupled;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Conference, 2006. APMC 2006. Asia-Pacific
Conference_Location
Yokohama
Print_ISBN
978-4-902339-08-6
Electronic_ISBN
978-4-902339-11-6
Type
conf
DOI
10.1109/APMC.2006.4429513
Filename
4429513
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