Title :
Semi-helical bondwire on-chip antenna
Author :
Yan, Jie-Bang ; Murch, Ross D.
Author_Institution :
Dept. of ECE, Hong Kong Univ. of Sci. & Technol., Hong Kong
Abstract :
This paper describes the design and performance of a semi-helical antenna fabricated on a high resistivity silicon substrate. The helical structure is realized by traces of bondwires. By adjusting the looping profile of the bondwires, various resonant frequencies can be obtained. Due to the helical structure and the inductance loading effect, the antenna is significantly miniaturized. In this paper, a semi-helical bondwire antenna resonating in the 5 GHz ISM band was designed and fabricated to demonstrate the idea. The size of the fabricated antenna is 5.30 mm times 2.30 mm and this corresponds to 0.092lambda0 times 0.040lambda0. Measurement results show good agreement with the simulation model. The fabricated antenna resonates at 5.2 GHz and has an impedance bandwidth of 220 MHz. The antenna has a measured gain of 0.96 dBi and a measured radiation efficiency of 40.3 %. The proposed antenna is therefore potentially suitable for IEEE 802.11a applications.
Keywords :
helical antennas; integrated circuit design; loop antennas; microwave antennas; wireless LAN; IEEE 802.11a application; ISM band; fabricated antenna; frequency 5 GHz; frequency 5.2 GHz; inductance loading effect; loop antenna; semi-helical bondwire on-chip antenna; Antenna measurements; Bonding; Conductivity; Gain measurement; Helical antennas; Impedance; Inductance; Loaded antennas; Resonant frequency; Silicon;
Conference_Titel :
Antennas and Propagation Society International Symposium, 2008. AP-S 2008. IEEE
Conference_Location :
San Diego, CA
Print_ISBN :
978-1-4244-2041-4
Electronic_ISBN :
978-1-4244-2042-1
DOI :
10.1109/APS.2008.4618926