DocumentCode :
2760354
Title :
Phase Change Memories challenges: A material and process perspective
Author :
Maitrejean, S. ; Ghezzi, G. ; Gourvest, E. ; Beneventi, G. Betti ; Fantini, A. ; Pashkov, N. ; Navarro, G. ; Roule, A. ; Fillot, F. ; Noé, P. ; Lhostis, S. ; Cueto, O. ; Jahan, C. ; Nodin, JF ; Persico, A. ; Armand, M. ; Dussault, L. ; Vallé, C. ; Michall
Author_Institution :
LETI, CEA, Grenoble, France
fYear :
2012
fDate :
4-6 June 2012
Firstpage :
1
Lastpage :
3
Abstract :
Among all the new memories concepts, Phase Change Memories (PCM) is one of the most promising. However, various challenges remain. This paper reviews the materials and processes required to face these challenges. As an example, attention will be made on the effect of Phase change material composition on stability of the amorphous phase i.e. on the retention of the information. Additionally, it is showed how specific processes such as CVD or ALD can be developed in order to minimize the current required to amorphize the phase change material i.e. to reset the device. Finally, with the perspectives of the advanced integration nodes, experimental results on the effect of scaling on phase transformation are presented and discussed.
Keywords :
phase change materials; phase change memories; ALD; CVD; PCM; advanced integration nodes; phase change material composition; phase change memories; phase transformation; Crystallization; Films; Phase change materials; Phase change memory; Switches; Thermal stability;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Interconnect Technology Conference (IITC), 2012 IEEE International
Conference_Location :
San Jose, CA
ISSN :
pending
Print_ISBN :
978-1-4673-1138-0
Electronic_ISBN :
pending
Type :
conf
DOI :
10.1109/IITC.2012.6251591
Filename :
6251591
Link To Document :
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