Title :
Repair Of Flip Chips (dca) On Glass Epoxy Printed Circuit Boards
Author :
Miller, Denny ; Gregorich, Tom ; Hoang, Hoang ; Mok, Swee
Keywords :
Assembly; Cost function; Driver circuits; Glass; Manufacturing; Packaging; Printed circuits; Robustness;
Conference_Titel :
Electronic Manufacturing Technology Symposium, 1993., Proceedings of 1993 Japan International
Print_ISBN :
0-7803-1432-8
DOI :
10.1109/IEMT.1993.639749
