Title :
Molding Compound Trends In A Denser Packaging World. I. Technology Evolution
Author :
Nguyen, L.T. ; Lo, R.H.Y. ; Belimi, J.G.
Keywords :
Application specific integrated circuits; Batteries; Electronic packaging thermal management; Electronics packaging; Integrated circuit packaging; Portable computers; Semiconductor device packaging; Thermal expansion; Thermal resistance; Thermal stresses;
Conference_Titel :
Electronic Manufacturing Technology Symposium, 1993., Proceedings of 1993 Japan International
Print_ISBN :
0-7803-1432-8
DOI :
10.1109/IEMT.1993.639753
