Flip-chip integration of selectively oxidized 850 nm VCSEL arrays

Author

Geib, Kent M. ; Choquette, K.D. ; Allerman, A.A. ; Hindi, J.J.

Author_Institution

Sandia Nat. Labs., Albuquerque, NM, USA

Volume

2

fYear

2000

fDate

2000

Firstpage

850

Abstract

Summary form only given. We report the fabrication techniques for flip-chip integration of selectively oxidized 850 nm 8x8 individually addressable VCSEL arrays. For robust integration of 2-dimensional 850 nm VCSEL arrays to microelectronics, there are three challenges to overcome: 1) reliable bonding; 2) mechanically stable packaging; and 3) through substrate light emission

Keywords

adhesion; flip-chip devices; infrared sources; integrated circuit packaging; integrated optoelectronics; laser transitions; optical fabrication; oxidation; semiconductor laser arrays; 850 nm; 850 nm 2D VCSEL arrays; fabrication techniques; flip-chip integration; mechanically stable packaging; reliable bonding; robust integration; selectively oxidized; selectively oxidized 850 nm 8x8 individually addressable VCSEL arrays; through substrate light emission; Bonding; Circuit testing; Gallium arsenide; Gold; Integrated circuit interconnections; Microelectronics; Packaging; Robustness; Substrates; Vertical cavity surface emitting lasers;

fLanguage

English

Publisher

ieee

Conference_Titel

Lasers and Electro-Optics Society 2000 Annual Meeting. LEOS 2000. 13th Annual Meeting. IEEE

Conference_Location

Rio Grande

ISSN

1092-8081

Print_ISBN

0-7803-5947-X

Type

conf

DOI

10.1109/LEOS.2000.894121

Filename

894121