Title :
Numerical analysis and IR scan test for thermal resistance of GaAs MMIC in a communications satellite
Author :
Kwak, Chang Soo ; Ahn, Ki Burm ; Chang, Dong Pil ; Yom, In Bok
Author_Institution :
Electron. & Telecommun. Res. Inst. (ETRI), Daejeon
Abstract :
Thermal resistance of a 3 GHz power amplifier MMIC has been calculated with finite element (FE) analyses. Through comparative FE analyses it has been found that a carrier for infrared (IR) scan test should have high thermal conductivity if it is for measuring thermal resistance of an MMIC only. IR scan results showed that the FE analysis provided temperature distribution quite close to the real and, also, that IR scans could not measure the maximum channel temperature because of not enough resolution. Consequently it has been proved that the FE method can provide more realistic thermal resistance of an MMIC than IR scan test when the gate length is smaller than IR scanner´s resolution as well as when the gate is screened by an airbridge.
Keywords :
MMIC power amplifiers; finite element analysis; satellite communication; temperature distribution; thermal conductivity; IR scan test; MMIC; communications satellite; finite element analyses; frequency 3 GHz; infrared scan test; power amplifier; temperature distribution; thermal conductivity; thermal resistance; Artificial satellites; Electrical resistance measurement; Gallium arsenide; MMICs; Numerical analysis; Power amplifiers; Temperature distribution; Testing; Thermal conductivity; Thermal resistance; IR scan; MMIC; power amplifier; thermal resistance;
Conference_Titel :
Microwave Conference, 2006. APMC 2006. Asia-Pacific
Conference_Location :
Yokohama
Print_ISBN :
978-4-902339-08-6
Electronic_ISBN :
978-4-902339-11-6
DOI :
10.1109/APMC.2006.4429581
