DocumentCode
2761328
Title
Atmospheric batch self-aligned assembly using Au-Sn solder bumps for optical MCM
Author
Sasaki, Juni´chi ; Itoh, Masataka
Author_Institution
Assoc. of Super-Adv. Electron. Technol., NTT Musashino Res. & Dev. Center, Tokyo, Japan
Volume
2
fYear
2000
fDate
2000
Firstpage
862
Abstract
We described a multichip module (MCM) structure suitable for building large-capacity optical interconnects using batch self-aligned assembly for optical devices. This technique was adapted to 622-Mbps x 12-channel optical interconnection modules. This technique was demonstrated to be effective for the assembly of highly integrated large-channel optical interconnection modules
Keywords
multichip modules; optical fabrication; optical interconnections; self-assembly; soldering; 12-channel optical interconnection modules; Au-Sn solder bumps; atmospheric batch self-aligned assembly; batch self-aligned assembly; highly integrated large-channel optical interconnection modules; large-capacity optical interconnects; multichip module structure; optical MCM; optical devices; Assembly; Bonding; Diode lasers; Optical arrays; Optical fiber networks; Optical interconnections; Optical receivers; Oxidation; Photodiodes; Semiconductor laser arrays;
fLanguage
English
Publisher
ieee
Conference_Titel
Lasers and Electro-Optics Society 2000 Annual Meeting. LEOS 2000. 13th Annual Meeting. IEEE
Conference_Location
Rio Grande
ISSN
1092-8081
Print_ISBN
0-7803-5947-X
Type
conf
DOI
10.1109/LEOS.2000.894127
Filename
894127
Link To Document