Automated optoelectronic packaging and applications to 10 Gb/s transponders

We have demonstrated technology which provides a cost-effective solution for the volume production of future high-performance high-speed devices such as SONET and 10 Gb transponders. The optical module assembly principle is shown. The module is assembled on a ceramic substrate with a metal platform for later optical assembly. Optical chips (laser, photodiodes...) and electronic components are then mounted by pick and place techniques commonly used in the electronic industry, using fluxless soldering processes, and within an accuracy of about 10 microns. Pick and place automation using machine vision is greatly facilitated by the quasi-planar design