Title :
Air Cooling Of Mcms Mounted On Card-on- Board Packaging Systems
Author :
Harada, Akio ; Kaneko, Yasuo ; Kishimoto, Tohru
Keywords :
B-ISDN; Cooling; Electronics packaging; Heat transfer; Packaging machines; Power dissipation; Switches; Telecommunication switching; Thermal resistance; Throughput;
Conference_Titel :
Electronic Manufacturing Technology Symposium, 1993., Proceedings of 1993 Japan International
Print_ISBN :
0-7803-1432-8
DOI :
10.1109/IEMT.1993.639761
