DocumentCode
2761418
Title
Air Cooling Of Mcms Mounted On Card-on- Board Packaging Systems
Author
Harada, Akio ; Kaneko, Yasuo ; Kishimoto, Tohru
fYear
1993
fDate
9-11 Jun 1993
Firstpage
246
Lastpage
249
Keywords
B-ISDN; Cooling; Electronics packaging; Heat transfer; Packaging machines; Power dissipation; Switches; Telecommunication switching; Thermal resistance; Throughput;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Manufacturing Technology Symposium, 1993., Proceedings of 1993 Japan International
Print_ISBN
0-7803-1432-8
Type
conf
DOI
10.1109/IEMT.1993.639761
Filename
639761
Link To Document