Optoelectronic chip on film (OE-COF) packaging technology

Author

Takahara, Hiroki

Author_Institution

Energy Labs., NTT Telecommun. Networks Labs., Tokyo

Volume

2

fYear

2000

fDate

2000

Firstpage

878

Abstract

Optoelectronic chip on film (OE-COF) packaging technology has been developed to meet next-generation OE packaging demands. LSIs and optical devices such as VCSELs and photodiodes are flip-chip bonded on the OE film using microsolder bumps. The bottom surfaces of the devices are die-bonded on a substrate or a package. Optical devices and optical waveguides are optically interconnected using 45-degree reflection mirrors. LSIs and optical devices are electrically interconnected through electrical lines via microsolder bumps with or without vias. OE film is optically coupled to input/output optical connectors at the edges

Keywords

flip-chip devices; integrated circuit packaging; integrated optoelectronics; large scale integration; multichip modules; optical communication equipment; optical interconnections; optical planar waveguides; soldering; surface emitting lasers; LSI; VCSEL; bottom surfaces; die-bonded; electrically interconnected; flip-chip bonding; input/output optical connectors; microsolder bumps; next-generation packaging; optical modules; optical waveguides; optically coupled film; optically interconnected; optoelectronic MCM; optoelectronic chip on film packaging; photodiodes; reflection mirrors; Bonding; Optical devices; Optical films; Optical interconnections; Optical surface waves; Optical waveguides; Packaging; Photodiodes; Substrates; Vertical cavity surface emitting lasers;

fLanguage

English

Publisher

ieee

Conference_Titel

Lasers and Electro-Optics Society 2000 Annual Meeting. LEOS 2000. 13th Annual Meeting. IEEE

Conference_Location

Rio Grande

ISSN

1092-8081

Print_ISBN

0-7803-5947-X

Type

conf

DOI

10.1109/LEOS.2000.894135

Filename

894135