Title :
Realization of High Efficiency Power Converter Circuits through Hybrid Microcircuit Packaging Techniques
Author :
Campbell, W.T. ; Krum, A.L. ; Geiser, R.W., Jr.
Author_Institution :
Hughes Aircraft Company, Newport Beach, CA
Keywords :
Aircraft; Bonding; Ceramics; Copper; Hybrid integrated circuits; Microelectronics; Packaging; Power conditioning; Switches; Switching circuits;
Conference_Titel :
Battery Conference on Applications and Advances, 1991. Proceedings of the Sixth Annual
DOI :
10.1109/BCAA.1991.761470
