Realization of High Efficiency Power Converter Circuits through Hybrid Microcircuit Packaging Techniques

Author

Campbell, W.T. ; Krum, A.L. ; Geiser, R.W., Jr.

Author_Institution

Hughes Aircraft Company, Newport Beach, CA

fYear

1991

fDate

1991

Firstpage

Lastpage

Keywords

Aircraft; Bonding; Ceramics; Copper; Hybrid integrated circuits; Microelectronics; Packaging; Power conditioning; Switches; Switching circuits;

fLanguage

English

Publisher

ieee

Conference_Titel

Battery Conference on Applications and Advances, 1991. Proceedings of the Sixth Annual

Type

DOI

10.1109/BCAA.1991.761470

Filename

761470

Link To Document