DocumentCode :
2761772
Title :
Creep in photovoltaic modules: Examining the stability of polymeric materials and components
Author :
Miller, David C. ; Kempe, Michael D. ; Glick, Stephen H. ; Kurtz, Sarah R.
Author_Institution :
Nat. Renewable Energy Lab. (NREL), Golden, CO, USA
fYear :
2010
fDate :
20-25 June 2010
Abstract :
Interest in renewable energy has motivated the implementation of new polymeric materials in photovoltaic modules. Some of these are non-cross-linked thermoplastics, in which there is a potential for new behaviors to occur, including phase transformation and visco-elastic flow. Differential scanning calorimetry and rheometry data were obtained and then combined with existing site-specific time-temperature information in a theoretical analysis to estimate the displacement expected to occur during module service life. The analysis identified that, depending on the installation location, module configuration and/or mounting configuration, some of the thermoplastics are expected to undergo unacceptable physical displacement. While the examples here focus on encapsulation materials, the concerns apply equally to the frame, junction-box, and mounting-adhesive technologies.
Keywords :
creep; differential scanning calorimetry; non-Newtonian flow; photovoltaic cells; polymers; renewable energy sources; creep; differential scanning calorimetry; encapsulation materials; installation location; module configuration; module service life; mounting configuration; mounting-adhesive technologies; noncross-linked thermoplastics; phase transformation; photovoltaic modules; polymeric components; polymeric materials; renewable energy; rheometry data; site-specific time-temperature information; unacceptable physical displacement; viscoelastic flow;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Photovoltaic Specialists Conference (PVSC), 2010 35th IEEE
Conference_Location :
Honolulu, HI
ISSN :
0160-8371
Print_ISBN :
978-1-4244-5890-5
Type :
conf
DOI :
10.1109/PVSC.2010.5615832
Filename :
5615832
Link To Document :
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