Title :
Novel miniaturized packaging for implantable electronic devices
Author :
Qian, Karen ; De Beeck, Maaike Op ; Bryce, George ; Malachowski, Karl ; Van Hoof, Chris
Author_Institution :
Imec, Leuven, Belgium
Abstract :
A novel biocompatible packaging process for implantable electronic systems is described, combining excellent biocompatibility and hermeticity with extreme miniaturization. Biocompatible and clean room compatible materials and integration processes are evaluated and selected for die encapsulation and interconnection. Cytotoxicity, diffusion tests and corrosion tests using DI water and more aggressive bio-fluids demonstrated promising performance of the packaging.
Keywords :
corrosion; electronics packaging; encapsulation; DI water; biocompatible packaging process; biofluids; corrosion tests; cytotoxicity; die encapsulation; diffusion tests; implantable electronic devices; integration processes; miniaturized packaging; Corrosion; Electrodes; Encapsulation; Implants; Materials; Standards;
Conference_Titel :
Interconnect Technology Conference (IITC), 2012 IEEE International
Conference_Location :
San Jose, CA
Print_ISBN :
978-1-4673-1138-0
Electronic_ISBN :
pending
DOI :
10.1109/IITC.2012.6251669
