Title :
The study of polyimide films and adhesion using a surface acoustic wave sensor
Author :
Galipeau, D.W. ; Feger, C. ; Vetelino, J.F. ; Lec, R.
Author_Institution :
Maine Univ., Orono, ME, USA
Abstract :
A dual delay line surface acoustic wave (SAW) sensor on an ST-quartz substrate has been used to study water uptake and downtake and its effect on adhesion in both cured and uncured polyimide films. Particular attention is focused on the effect that an adhesion promoter may have on the strength of the adhesive bond. Film samples both with and without an adhesion promoter were studied. The experimental results suggest the possibility of using a SAW sensor as a cure indicator, humidity sensor, or adhesion sensor
Keywords :
adhesion; polymer films; surface acoustic wave devices; ultrasonic materials testing; adhesion promoter; adhesion sensor; adhesive bond; cure indicator; cured polyimide films; dual delay line surface acoustic wave sensor; humidity sensor; strength; uncured polyimide films; water uptake; Acoustic sensors; Acoustic waves; Adhesives; Bonding; Delay lines; Humidity; Polyimides; Sensor phenomena and characterization; Substrates; Surface acoustic waves;
Conference_Titel :
Ultrasonics Symposium, 1990. Proceedings., IEEE 1990
Conference_Location :
Honolulu, HI
DOI :
10.1109/ULTSYM.1990.171529
