DocumentCode
2761955
Title
The study of polyimide films and adhesion using a surface acoustic wave sensor
Author
Galipeau, D.W. ; Feger, C. ; Vetelino, J.F. ; Lec, R.
Author_Institution
Maine Univ., Orono, ME, USA
fYear
1990
fDate
4-7 Dec 1990
Firstpage
1087
Abstract
A dual delay line surface acoustic wave (SAW) sensor on an ST-quartz substrate has been used to study water uptake and downtake and its effect on adhesion in both cured and uncured polyimide films. Particular attention is focused on the effect that an adhesion promoter may have on the strength of the adhesive bond. Film samples both with and without an adhesion promoter were studied. The experimental results suggest the possibility of using a SAW sensor as a cure indicator, humidity sensor, or adhesion sensor
Keywords
adhesion; polymer films; surface acoustic wave devices; ultrasonic materials testing; adhesion promoter; adhesion sensor; adhesive bond; cure indicator; cured polyimide films; dual delay line surface acoustic wave sensor; humidity sensor; strength; uncured polyimide films; water uptake; Acoustic sensors; Acoustic waves; Adhesives; Bonding; Delay lines; Humidity; Polyimides; Sensor phenomena and characterization; Substrates; Surface acoustic waves;
fLanguage
English
Publisher
ieee
Conference_Titel
Ultrasonics Symposium, 1990. Proceedings., IEEE 1990
Conference_Location
Honolulu, HI
Type
conf
DOI
10.1109/ULTSYM.1990.171529
Filename
171529
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