• DocumentCode
    2762016
  • Title

    Numerical simulation of ultrasound NDE for adhesive bond integrity

  • Author

    Sullivan, John M., Jr. ; Ludwig, Reinhold ; Geng, Yiping

  • Author_Institution
    Worcester Polytech. Inst., MA, USA
  • fYear
    1990
  • fDate
    4-7 Dec 1990
  • Firstpage
    1095
  • Abstract
    A multiple attack strategy (analytical, numerical, and experimental investigations) has been developed for the evaluation of adhesive bond integrity. This coupled approach capitalizes on the ability of numerical simulations to provide a transparent viewing window to the underlying physics at the interface. A finite element model solves the transient elastodynamic equation of motion subject to realistic boundary and initial conditions. Three material regions were identified in the model. The numerical predictions of the ultrasonic wave propagations include reflections and trapped waveforms within the sandwiched material. Substantial differences are noted between bonded and disbond regions. These results show excellent agreement with theory and with results measured experimentally
  • Keywords
    adhesion; finite element analysis; simulation; ultrasonic materials testing; adhesive bond integrity; boundary conditions; disbond regions; finite element model; initial conditions; multiple attack strategy; numerical simulations; reflections; sandwiched material; transient elastodynamic equation of motion; transparent viewing window; trapped waveforms; ultrasonic wave propagations; Acoustic imaging; Bonding; Elastodynamics; Equations; Finite element methods; Magnetic resonance imaging; Numerical simulation; Physics; Stress; Ultrasonic imaging;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ultrasonics Symposium, 1990. Proceedings., IEEE 1990
  • Conference_Location
    Honolulu, HI
  • Type

    conf

  • DOI
    10.1109/ULTSYM.1990.171531
  • Filename
    171531