DocumentCode
2762016
Title
Numerical simulation of ultrasound NDE for adhesive bond integrity
Author
Sullivan, John M., Jr. ; Ludwig, Reinhold ; Geng, Yiping
Author_Institution
Worcester Polytech. Inst., MA, USA
fYear
1990
fDate
4-7 Dec 1990
Firstpage
1095
Abstract
A multiple attack strategy (analytical, numerical, and experimental investigations) has been developed for the evaluation of adhesive bond integrity. This coupled approach capitalizes on the ability of numerical simulations to provide a transparent viewing window to the underlying physics at the interface. A finite element model solves the transient elastodynamic equation of motion subject to realistic boundary and initial conditions. Three material regions were identified in the model. The numerical predictions of the ultrasonic wave propagations include reflections and trapped waveforms within the sandwiched material. Substantial differences are noted between bonded and disbond regions. These results show excellent agreement with theory and with results measured experimentally
Keywords
adhesion; finite element analysis; simulation; ultrasonic materials testing; adhesive bond integrity; boundary conditions; disbond regions; finite element model; initial conditions; multiple attack strategy; numerical simulations; reflections; sandwiched material; transient elastodynamic equation of motion; transparent viewing window; trapped waveforms; ultrasonic wave propagations; Acoustic imaging; Bonding; Elastodynamics; Equations; Finite element methods; Magnetic resonance imaging; Numerical simulation; Physics; Stress; Ultrasonic imaging;
fLanguage
English
Publisher
ieee
Conference_Titel
Ultrasonics Symposium, 1990. Proceedings., IEEE 1990
Conference_Location
Honolulu, HI
Type
conf
DOI
10.1109/ULTSYM.1990.171531
Filename
171531
Link To Document