• DocumentCode
    2762025
  • Title

    A software development kit for dependable applications in embedded systems

  • Author

    Benso, Alfredo ; Chiusano, Ilvia ; Prinetto, Paolo

  • Author_Institution
    Dipt. di Autom. e Inf., Politecnico di Torino, Italy
  • fYear
    2000
  • fDate
    2000
  • Firstpage
    170
  • Lastpage
    178
  • Abstract
    In this paper we present DSDK1, a Dependable Software Development Kit designed to support the software engineer in releasing dependable applications for embedded systems, starting from either commercial or native software. The proposed kit integrates four different tools: RECCO, a source-to-source compiler able to transform any C/C++ native source code in a more dependable version of the same code, WRAP a tool able to wrap executable software modules and transparently enhance their dependability characteristic, EXEM, an external world and device emulator fool, and BOND, a powerful Fault Injection environment able to emulate the occurrence of different types of faults in the system and to evaluate the dependability properties of the overall system. Experimental results gathered on an embedded system running Embedded NT OS demonstrate the effectiveness and the flexibility of the tool
  • Keywords
    C++ language; embedded systems; fault simulation; program compilers; software fault tolerance; software tools; source coding; BOND; C/C++ native source code; Dependable Software Development Kit; EXEM; Embedded NT OS; RECCO; commercial software; dependability properties; effectiveness; fault injection environment; flexibility; native software; software development kit; source-to-source compiler; wrap executable software modules; Application software; Computer errors; Embedded software; Embedded system; Hardware; Programming; Software performance; Software testing; Software tools; System testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Test Conference, 2000. Proceedings. International
  • Conference_Location
    Atlantic City, NJ
  • ISSN
    1089-3539
  • Print_ISBN
    0-7803-6546-1
  • Type

    conf

  • DOI
    10.1109/TEST.2000.894204
  • Filename
    894204