DocumentCode :
2762167
Title :
Actual problems of thin film deposition for hybrid applications
Author :
Muralt, P. ; Seidel, J.P.
Author_Institution :
Balzers AG, Liechtenstein
fYear :
1989
fDate :
26-28 Apr 1989
Firstpage :
251
Lastpage :
254
Abstract :
The LLS 900 load lock system is described. Its four planar magnetron stations operated with either DC or RF power and three reactive gas inlets allow complex processes to be performed. Automatic control and execution of process parameters ensures a good reproducibility. The use of the LLS 900 system for the solution of actual manufacturing problems in the case of hybrid coatings is discussed. Examples of low TCR (temperature coefficient of resistance) films with a high sheet resistance, reliable barrier layers near-bulk-resistivity gold contact layers, and high-resistivity isolation layers are considered
Keywords :
hybrid integrated circuits; integrated circuit technology; sputter deposition; Au contact layers; LLS 900 load lock system; RF power; TCR; barrier layers; complex processes; high-resistivity isolation layers; hybrid applications; hybrid coatings; planar magnetron stations; reactive gas inlets; reproducibility; sheet resistance; thin film deposition; Automatic control; Coatings; Conductivity; Gold; Manufacturing; Packaging machines; Reproducibility of results; Resistors; Sputtering; Substrates;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Manufacturing Technology Symposium, 1989, Proceedings. Japan IEMT Symposium, Sixth IEEE/CHMT International
Conference_Location :
Nara
Type :
conf
DOI :
10.1109/IEMTS.1989.76150
Filename :
76150
Link To Document :
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