• DocumentCode
    2762282
  • Title

    Hybrid finite element methods for the numerical simulation of the sensor and actuator performance of composite transducers including the effect of fluid loading

  • Author

    Varadan, V.V. ; Chin, L.-C. ; Varadan, V.K.

  • Author_Institution
    Pennsylvania State Univ., University Park, PA, USA
  • fYear
    1990
  • fDate
    4-7 Dec 1990
  • Firstpage
    1177
  • Abstract
    The finite-element eigenmode approach is presented for the analysis of the dynamic performance of a composite transducer submerged in a fluid medium. The composite transducer is composed of periodically arranged piezoelectric rods in a polymer matrix. The Floquet theorem is applied to simplify the infinite domain problem to that involving a unit cell only. Numerical examples of the transmitting voltage response, electric conductance and transmission/reflection coefficient spectra for different volume concentrations of the piezoelectric phase in the composite transducers are given. Numerical results are also computed for 1-3 composite structures with different diameter-to-length values for the piezoelectric rods
  • Keywords
    dynamic response; eigenvalues and eigenfunctions; finite element analysis; piezoelectric transducers; ultrasonic transducers; underwater sound; vibrations; Floquet theorem; actuator performance; composite transducers; dynamic performance; effect of fluid loading; electric conductance; finite-element eigenmode approach; hybrid FEM; infinite domain problem; numerical simulation; periodically arranged piezoelectric rods; polymer matrix; sensor performance; transmission/reflection coefficient spectra; transmitting voltage response; vibrations; wave-material interactions; Acoustic sensors; Acoustic transducers; Acoustical engineering; Actuators; Finite element methods; Numerical simulation; Packaging; Piezoelectric transducers; Polymers; Ultrasonic transducers;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ultrasonics Symposium, 1990. Proceedings., IEEE 1990
  • Conference_Location
    Honolulu, HI
  • Type

    conf

  • DOI
    10.1109/ULTSYM.1990.171547
  • Filename
    171547