DocumentCode :
2762450
Title :
Cream Solder Inspection Technology By Projecting Phase-shifted Fringes
Author :
Shlgeyama, Y. ; Kakimori, N. ; Yamamoto, Y. ; Iwata, Y. ; Nlshigakl, K. ; Nakamura, H.
fYear :
1993
fDate :
9-11 Jun 1993
Firstpage :
291
Lastpage :
294
Keywords :
Bonding; Electronics packaging; Inspection; Manufacturing processes; Packaging machines; Phase measurement; Production systems; Quality control; Soldering; Surface fitting;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Manufacturing Technology Symposium, 1993., Proceedings of 1993 Japan International
Print_ISBN :
0-7803-1432-8
Type :
conf
DOI :
10.1109/IEMT.1993.639773
Filename :
639773
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2762450
