DocumentCode
2762450
Title
Cream Solder Inspection Technology By Projecting Phase-shifted Fringes
Author
Shlgeyama, Y. ; Kakimori, N. ; Yamamoto, Y. ; Iwata, Y. ; Nlshigakl, K. ; Nakamura, H.
fYear
1993
fDate
9-11 Jun 1993
Firstpage
291
Lastpage
294
Keywords
Bonding; Electronics packaging; Inspection; Manufacturing processes; Packaging machines; Phase measurement; Production systems; Quality control; Soldering; Surface fitting;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Manufacturing Technology Symposium, 1993., Proceedings of 1993 Japan International
Print_ISBN
0-7803-1432-8
Type
conf
DOI
10.1109/IEMT.1993.639773
Filename
639773
Link To Document