DocumentCode :
2762492
Title :
Decreasing the time-to-market through virtual risk assessment and risk mitigation
Author :
Pecht, Michael G. ; McCluskey, Patrick F. ; West, Norman W. ; Azarm, Shapour ; Pecht, Judy
Author_Institution :
CALCE Center for Electron. Packaging, Maryland Univ., College Park, MD, USA
Volume :
1
fYear :
1997
fDate :
14-17 Sep 1997
Firstpage :
25
Abstract :
One of the most time consuming activities in new product development is reliability risk assessment, defined as an audit of the ability of the design, manufacture, and assembly processes to meet reliability goals; that is, whether the anticipated reliability is indeed achieved under actual life cycle loads for some specified length of time. In general, qualification methods have been borrowed from the military, without knowledge of the rationale or assessment of the true benefits. In fact, prediction of field reliability from these tests has generally been quite poor. Nevertheless, the amount and length of such qualification testing has increased over the years. This presentation provides a background to the reliability risk assessment problem that much of the electronics product and systems industry is faced with today. Then an approach to reliability risk assessment and risk mitigation is given, along with a virtual method, which requires very little time and money, because the process is simulated
Keywords :
conformance testing; electronics industry; failure analysis; product development; reliability theory; risk management; electronic systems industry; electronics product industry; field reliability; product development; qualification testing; reliability risk assessment; risk mitigation; virtual method; Application specific integrated circuits; Assembly; Costs; Life estimation; Life testing; Military standards; Product development; Qualifications; Risk management; Time to market;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microelectronics, 1997. Proceedings., 1997 21st International Conference on
Conference_Location :
Nis
Print_ISBN :
0-7803-3664-X
Type :
conf
DOI :
10.1109/ICMEL.1997.625171
Filename :
625171
Link To Document :
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