DocumentCode :
2762513
Title :
Modeling lifetime of high power IGBTs in wind power applications - An overview
Author :
Busca, Cristian
Author_Institution :
Dept. of Energy Technol., Aalborg Univ., Aalborg, Denmark
fYear :
2011
fDate :
27-30 June 2011
Firstpage :
1408
Lastpage :
1413
Abstract :
The wind power industry is continuously developing bringing to the market larger and larger wind turbines. Nowadays reliability is more of a concern than in the past especially for the offshore wind turbines since the access to offshore wind turbines in case of failures is both costly and difficult. Lifetime modeling of future large wind turbines is needed in order to make reliability predictions about these new wind turbines early in the design phase. By doing reliability prediction in the design phase the manufacturer can ensure that the new wind turbines will live long enough. This paper represents an overview of the different aspects of lifetime modeling of high power IGBTs in wind power applications. In the beginning, wind turbine reliability survey results are briefly reviewed in order to gain an insight into wind turbine subassembly failure rates and associated downtimes. After that the most common high power IGBT failure mechanisms and lifetime prediction models are reviewed in more detail.
Keywords :
insulated gate bipolar transistors; offshore installations; power bipolar transistors; power generation reliability; wind turbines; high power IGBT; lifetime modeling; offshore wind turbine reliability; wind power applications; wind power industry; wind turbine subassembly failure rates; Failure analysis; Insulated gate bipolar transistors; Reliability; Soldering; Wind power generation; Wind turbines; Wires;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Industrial Electronics (ISIE), 2011 IEEE International Symposium on
Conference_Location :
Gdansk
ISSN :
Pending
Print_ISBN :
978-1-4244-9310-4
Electronic_ISBN :
Pending
Type :
conf
DOI :
10.1109/ISIE.2011.5984366
Filename :
5984366
Link To Document :
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