DocumentCode
2762527
Title
Impact of materials on back-contact module reliability
Author
Guichoux, M. ; Tjengdrawira, C. ; Veldman, D. ; de Jong, P.C.
Author_Institution
Solar Energy, Energy Res. Centre of the Netherlands, Petten, Netherlands
fYear
2010
fDate
20-25 June 2010
Abstract
This paper discusses the impact of several combinations of encapsulants, conductive adhesives and back-sheet foils on ECN´s back-contact modules performance and reliability. Damp-heat (85°C; 85% R.H) and thermal cycling (-40°C; +85°C) tests were performed up to twice as long as described in the IEC-61215 standard, i.e. 2000 hours of damp-heat and 400 thermal cycles. These tests have been identified as the most important tests for this technology. After climatic chamber testing, the modules were analyzed visually and by electro-luminescence imaging.
Keywords
IEC standards; conductive adhesives; electroluminescence; encapsulation; reliability; solar cells; ECN back-contact modules; IEC-61215 standard; back-contact module reliability; back-sheet foils; climatic chamber testing; conductive adhesives; damp heat; electroluminescence imaging; encapsulants; materials impact; temperature -40 degC; temperature 85 degC; thermal cycling;
fLanguage
English
Publisher
ieee
Conference_Titel
Photovoltaic Specialists Conference (PVSC), 2010 35th IEEE
Conference_Location
Honolulu, HI
ISSN
0160-8371
Print_ISBN
978-1-4244-5890-5
Type
conf
DOI
10.1109/PVSC.2010.5615877
Filename
5615877
Link To Document