Title :
Highly miniaturized on-chip RF components employing PPGM with single-sided via holes for application to GaAs MMIC
Author :
Yun, Young ; Kim, Chung-Ryul ; Lee, Kyung-Sik ; Park, Young-Bae ; Lee, Dong-Whan
Author_Institution :
Korea Maritime Univ., Busan
Abstract :
In this work, using a microstrip line employing periodically perforated ground metal (PPGM) with single-sided via holes on GaAs MMIC, highly miniaturized and broadband on-chip passive components were developed for application to GaAs MMIC. The passive components employing PPGM were highly miniaturized compared with conventional ones.
Keywords :
MMIC; gallium arsenide; microstrip lines; GaAs; MMIC; PPGM; broadband on-chip passive components; highly miniaturized on-chip RF components; microstrip line; passive components; periodically perforated ground metal; single-sided via holes; Broadband communication; Capacitance; Gallium arsenide; Impedance; Insertion loss; MMICs; Microstrip components; Microwave integrated circuits; Monolithic integrated circuits; Radio frequency; GaAs; MMIC; On-chip; PPGM; RF component;
Conference_Titel :
Microwave Conference, 2006. APMC 2006. Asia-Pacific
Conference_Location :
Yokohama
Print_ISBN :
978-4-902339-08-6
Electronic_ISBN :
978-4-902339-11-6
DOI :
10.1109/APMC.2006.4429651
