DocumentCode
2762737
Title
Modeling Si-Ge interdiffusion by a vacancy exchange mechanism
Author
Hasanuzzaman, Mohammad ; Haddara, Yaser M.
Author_Institution
Dept. of Electr. & Comput. Eng., McMaster Univ., Hamilton, Ont.
fYear
2005
fDate
1-4 May 2005
Firstpage
1547
Lastpage
1550
Abstract
The vacancy exchange mechanism was used to model the inter diffusion of Si and Ge in Si/Si1-xGex/Si single quantum well structures. Diffusion was modeled for samples grown by molecular beam epitaxy and annealed at 900degC, 1000degC and 1100degC for different times in inert and oxidizing ambients. Intrinsic self diffusivities of Si and Ge as a function of Ge fraction in the structure used as the fitting parameters match values reported in the literature. Once these parameters were fixed for the inert ambient, the diffusion behavior under oxidizing conditions was completely accounted for by the model with no additional fitting parameters. Excellent fits were obtained in all the cases
Keywords
Ge-Si alloys; annealing; chemical interdiffusion; elemental semiconductors; self-diffusion; semiconductor epitaxial layers; semiconductor materials; semiconductor quantum wells; silicon; vacancies (crystal); Si-Ge interdiffusion; Si-Si1-xGex-Si; SiGe; molecular beam epitaxy; oxidizing conditions; quantum well structures; vacancy exchange mechanism; Annealing; Atomic layer deposition; CMOS technology; Germanium silicon alloys; Heterojunction bipolar transistors; Molecular beam epitaxial growth; Semiconductor process modeling; Silicon germanium; Temperature; X-ray scattering;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical and Computer Engineering, 2005. Canadian Conference on
Conference_Location
Saskatoon, Sask.
ISSN
0840-7789
Print_ISBN
0-7803-8885-2
Type
conf
DOI
10.1109/CCECE.2005.1557275
Filename
1557275
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