Title :
Influence Of Newly Molding Compound Properties On Package Failure During Reflow Soldering Process
Author :
Murayama, Masakazu ; Ito, Hiromi ; Tada, Kazuhiro ; Fujioka, Hirofumi ; Kanegae, Hirozoh
Keywords :
Absorption; Glass; Mechanical factors; Moisture; Plastic packaging; Reflow soldering; Resins; Surface cracks; Temperature; Thermal resistance;
Conference_Titel :
Electronic Manufacturing Technology Symposium, 1993., Proceedings of 1993 Japan International
Print_ISBN :
0-7803-1432-8
DOI :
10.1109/IEMT.1993.639785
