DocumentCode

2762954

Title

Conditions For Reliable Ball-wedge Copper Wire Bonding

Author

Caers, J.F.J.M. ; Bischoff, A. ; Falk, J. ; Roggen, J.

fYear

1993

fDate

9-11 Jun 1993

Firstpage

312

Lastpage

315

Keywords

Bonding processes; Copper; Etching; Gold; Microstructure; Oxidation; Pollution measurement; Scanning electron microscopy; Testing; Wire;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Manufacturing Technology Symposium, 1993., Proceedings of 1993 Japan International

Print_ISBN

0-7803-1432-8

Type

conf

DOI

10.1109/IEMT.1993.639786

Filename

639786