Title :
Conditions For Reliable Ball-wedge Copper Wire Bonding
Author :
Caers, J.F.J.M. ; Bischoff, A. ; Falk, J. ; Roggen, J.
Keywords :
Bonding processes; Copper; Etching; Gold; Microstructure; Oxidation; Pollution measurement; Scanning electron microscopy; Testing; Wire;
Conference_Titel :
Electronic Manufacturing Technology Symposium, 1993., Proceedings of 1993 Japan International
Print_ISBN :
0-7803-1432-8
DOI :
10.1109/IEMT.1993.639786
