DocumentCode

2763012

Title

Degradation Of Tab Outer Lead Contacts Due To The Au Concentration In Eutectic Tin/lead Solder

Author

Zakel, EIke ; Azdasht, Ghassem ; Reich, H.

fYear

1993

fDate

9-11 Jun 1993

Firstpage

322

Lastpage

329

Keywords

Bonding; Copper; Degradation; Failure analysis; Gold; Intermetallic; Lead; Metallization; Temperature; Tin;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Manufacturing Technology Symposium, 1993., Proceedings of 1993 Japan International

Print_ISBN

0-7803-1432-8

Type

conf

DOI

10.1109/IEMT.1993.639790

Filename

639790