Title :
Degradation Of Tab Outer Lead Contacts Due To The Au Concentration In Eutectic Tin/lead Solder
Author :
Zakel, EIke ; Azdasht, Ghassem ; Reich, H.
Keywords :
Bonding; Copper; Degradation; Failure analysis; Gold; Intermetallic; Lead; Metallization; Temperature; Tin;
Conference_Titel :
Electronic Manufacturing Technology Symposium, 1993., Proceedings of 1993 Japan International
Print_ISBN :
0-7803-1432-8
DOI :
10.1109/IEMT.1993.639790
