Title :
A Comparative Study Of Cohhercially Availarle No-Clean Solder Pastes : The Influence Of A Protective Atmosphere
Author :
Potier, N. ; Mellul, S. ; Leturmy, M.
Keywords :
Assembly; Atmosphere; Cleaning; Manufacturing; Protection; Soldering; Solvents; Surface-mount technology; Testing; Vehicles;
Conference_Titel :
Electronic Manufacturing Technology Symposium, 1993., Proceedings of 1993 Japan International
Print_ISBN :
0-7803-1432-8
DOI :
10.1109/IEMT.1993.639794
