DocumentCode
2763472
Title
Tape Automated Bonding Packages: Electrical Considerations For High Frequency Applications
fYear
1993
fDate
9-11 Jun 1993
Firstpage
341
Lastpage
344
Keywords
Attenuation; Bonding; Ceramics; Conductors; Coplanar transmission lines; Dielectric constant; Frequency; Impedance; Integrated circuit packaging; Power transmission lines;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Manufacturing Technology Symposium, 1993., Proceedings of 1993 Japan International
Print_ISBN
0-7803-1432-8
Type
conf
DOI
10.1109/IEMT.1993.639798
Filename
639798
Link To Document