• DocumentCode
    2763560
  • Title

    Fabrication of Silicon on Lattice-Engineered Substrate (SOLES) as a Platform for Monolithic Integration of CMOS and Optoelectronic Devices

  • Author

    Dohrman, Carl L. ; Chilukuri, K. ; Isaacson, D.M. ; Lee, Minjoo Larry ; Fitzgerald, E.A.

  • Author_Institution
    Dept. of Mater. Sci. & Eng., Massachusetts Inst. of Technol., Cambridge, MA
  • fYear
    2006
  • fDate
    15-17 May 2006
  • Firstpage
    1
  • Lastpage
    2
  • Abstract
    We report the fabrication of a novel substrate platform for the monolithic integration of Si-based CMOS and GaAs-based optoelectronic devices. This platform, which we refer to as silicon on lattice-engineered substrate (SOLES), consists of a compositionally graded SiGe buffer buried underneath a silicon-on-insulator (SOI) structure, all fabricated on a Si substrate
  • Keywords
    CMOS integrated circuits; Ge-Si alloys; III-V semiconductors; gallium arsenide; integrated optoelectronics; silicon-on-insulator; wafer bonding; CMOS-optoelectronic devices integration; GaAs; SOLES; SiGe; monolithic integration; silicon on lattice-engineered substrate; silicon-on-insulator structure; substrate platform; Germanium silicon alloys; Materials science and technology; Monolithic integrated circuits; Optical device fabrication; Optoelectronic devices; Rough surfaces; Silicon alloys; Silicon germanium; Surface roughness; Wafer bonding;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    SiGe Technology and Device Meeting, 2006. ISTDM 2006. Third International
  • Conference_Location
    Princeton, NJ
  • Print_ISBN
    1-4244-0461-4
  • Type

    conf

  • DOI
    10.1109/ISTDM.2006.246586
  • Filename
    1715955