Title :
Inkjet plating resist for improved cell efficency
Author :
Dong, Hua ; Barr, Robert ; Hinkley, Peter
Author_Institution :
Dow Electron. Mater., Marlborough, MA, USA
Abstract :
The use of a resist applied before nickel and silver plating can greatly reduce background plating while helping to control plated line width spread on the front side of the solar cell grid. Reduced line spread helps to minimize shadowing and has a positive impact on cell efficiency.
Keywords :
electroplating; nickel; silver; solar cells; Ag; Ni; cell efficiency; inkjet plating resist; plated line width spread control; solar cell grid;
Conference_Titel :
Photovoltaic Specialists Conference (PVSC), 2010 35th IEEE
Conference_Location :
Honolulu, HI
Print_ISBN :
978-1-4244-5890-5
DOI :
10.1109/PVSC.2010.5615932
