DocumentCode
2763681
Title
1999 IEEE International Reliability Physics Symposium Proceedings. 37th Annual (Cat. No.99CH36296)
fYear
1999
fDate
23-25 March 1999
Abstract
The following topics were discussed: device and process reliability; dielectrics and compound semiconductors; ESD and latchup; microelectromechanical systems; interconnects; hot carriers; failure analysis; packaging and assembly; plasma induced damage
Keywords
dielectric materials; electrostatic discharge; failure analysis; hot carriers; integrated circuit interconnections; integrated circuit packaging; integrated circuit reliability; micromechanical devices; plasma materials processing; semiconductor device reliability; semiconductors; ESD; assembly; compound semiconductors; device reliability; dielectrics; failure analysis; hot carriers; interconnects; latchup; microelectromechanical systems; packaging; plasma induced damage; process reliability;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability Physics Symposium Proceedings, 1999. 37th Annual. 1999 IEEE International
Conference_Location
San Diego, CA, USA
Print_ISBN
0-7803-5220-3
Type
conf
DOI
10.1109/RELPHY.1999.761583
Filename
761583
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