Title :
1999 IEEE International Reliability Physics Symposium Proceedings. 37th Annual (Cat. No.99CH36296)
Abstract :
The following topics were discussed: device and process reliability; dielectrics and compound semiconductors; ESD and latchup; microelectromechanical systems; interconnects; hot carriers; failure analysis; packaging and assembly; plasma induced damage
Keywords :
dielectric materials; electrostatic discharge; failure analysis; hot carriers; integrated circuit interconnections; integrated circuit packaging; integrated circuit reliability; micromechanical devices; plasma materials processing; semiconductor device reliability; semiconductors; ESD; assembly; compound semiconductors; device reliability; dielectrics; failure analysis; hot carriers; interconnects; latchup; microelectromechanical systems; packaging; plasma induced damage; process reliability;
Conference_Titel :
Reliability Physics Symposium Proceedings, 1999. 37th Annual. 1999 IEEE International
Conference_Location :
San Diego, CA, USA
Print_ISBN :
0-7803-5220-3
DOI :
10.1109/RELPHY.1999.761583
