DocumentCode :
2763833
Title :
Variation of acoustic impedance caused by a cut in ultrasonic transducers
Author :
Watanabe, K. ; Iida, A. ; Namiki, F. ; Kawabe, K. ; Shimura, T.
Author_Institution :
Fujitsu Labs. Ltd., Kawasaki, Japan
fYear :
1989
fDate :
26-28 Apr 1989
Firstpage :
290
Lastpage :
293
Abstract :
The authors describe the measurement of the acoustic impedance of the backing of an ultrasonic array transducer consisting of piezoelectric ceramic and backing and matching layers. The transducer is made by sawing the piezoelectric ceramic into array elements. The backing is also cut slightly so that each element can be driven independently, without acoustic cross-coupling between elements. The authors devised a way to measure the acoustic impedance of the sawn part of the backing, which presented difficulties because of its small size. The method uses the reflection coefficient spectrum at the surface of the sawn backing. The measured impedance of the sawed part was 5.33×106 kg/m2 s, and that of the solid part was 6.35×106 kg/m2 s. It is shown that the impedance of the sawn part of the backing is less than that of the solid backing, even though the material is the same. From this, the array transducer´s electroacoustic conversion characteristics were obtained by computer simulation, accounting for the effect of the sawn part of the backing, and were in excellent agreement with experiment
Keywords :
acoustic impedance; ceramics; piezoelectric transducers; ultrasonic transducers; acoustic impedance; array transducer; computer simulation; cut; electroacoustic conversion characteristics; piezoelectric ceramic; reflection coefficient spectrum; ultrasonic transducers; Acoustic measurements; Acoustic transducers; Ceramics; Impedance measurement; Piezoelectric transducers; Solids; Surface impedance; Ultrasonic transducer arrays; Ultrasonic transducers; Ultrasonic variables measurement;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Manufacturing Technology Symposium, 1989, Proceedings. Japan IEMT Symposium, Sixth IEEE/CHMT International
Conference_Location :
Nara
Type :
conf
DOI :
10.1109/IEMTS.1989.76159
Filename :
76159
Link To Document :
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