Title :
Influence of soft breakdown on NMOSFET device characteristics
Author :
Pompl, T. ; Wurzer, H. ; Kerber, M. ; Wilkins, R.C.W. ; Eisele, I.
Author_Institution :
Siemens Semicond. Group, Muenchen, Germany
Abstract :
The degradation of important transistor parameters related to soft breakdown and hard breakdown were studied. Long and short channel transistors were homogeneously stressed at elevated temperature until soft breakdown or hard breakdown occurred. The only noticeable signature of soft breakdown is an increase in off current due to enhanced gate induced drain leakage current. This effect arises if the soft breakdown is located within the gate-to-drain overlap region. Soft breakdown generates a spot or path of negative charges in the oxide and therefore enhances gate induced drain leakage current
Keywords :
MOSFET; leakage currents; semiconductor device breakdown; semiconductor device reliability; semiconductor device testing; NMOSFET device characteristics; SiO2-Si; gate induced drain leakage current; gate-to-drain overlap region; hard breakdown; homogeneously stressed transistors; long channel transistors; off current; oxide negative charge path; oxide negative charge spot; short channel transistors; soft breakdown; soft breakdown signature; transistor parameters; Breakdown voltage; Current measurement; Degradation; Dielectric measurements; Electric breakdown; Leakage current; MOSFET circuits; Monitoring; Stress measurement; Testing;
Conference_Titel :
Reliability Physics Symposium Proceedings, 1999. 37th Annual. 1999 IEEE International
Conference_Location :
San Diego, CA
Print_ISBN :
0-7803-5220-3
DOI :
10.1109/RELPHY.1999.761596