DocumentCode

2764096

Title

Thermal Stress Analysis Of Conductive Adhesive Joints

Author

Ogunjimi, A.O. ; Whalley, D.C. ; Williams, D.J.

fYear

1993

fDate

9-11 Jun 1993

Firstpage

349

Lastpage

353

Keywords

Assembly; Bonding; Conductive adhesives; Curing; Geometry; Manufacturing; Material properties; Silicon; Thermal conductivity; Thermal stresses;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Manufacturing Technology Symposium, 1993., Proceedings of 1993 Japan International

Print_ISBN

0-7803-1432-8

Type

conf

DOI

10.1109/IEMT.1993.639801

Filename

639801