Title :
The effect of humidity on the reliability of a surface micromachined microengine
Author :
Tanner, Danelle M. ; Walraven, Jeremy A. ; Irwin, Lloyd W. ; Dugger, Michael T. ; Smith, Norman F. ; Eaton, William P. ; Miller, William M. ; Miller, Samuel L.
Author_Institution :
Sandia Nat. Labs., Albuquerque, NM, USA
Abstract :
Humidity is shown to be a strong factor in the wear of rubbing surfaces in polysilicon micromachines. We demonstrate that very low humidity can lead to very high wear without a significant change in reliability. We show that the volume of wear debris generated is a function of the humidity in an air environment. As the humidity decreases, the wear debris generated increases. For the higher humidity levels, the formation of surface hydroxides may act as a lubricant. The dominant failure mechanism has been identified as wear. The wear debris has been identified as amorphous oxidized silicon. Large slivers (approximately 1 μm in length) of debris observed at the low humidity level were also amorphous oxidized silicon. Using transmission electron microscopy (TEM), we observed that the wear debris forms spherical and rod-like shapes. We compared two surface treatment processes: a fluorinated silane chain (FTS) process and supercritical CO2 dried (SCCO2) process. The microengines using the SCCO2 process were found to be less reliable than those released with the FTS process under two humidity levels
Keywords :
elemental semiconductors; humidity; micromachining; micromotors; reliability; semiconductor device testing; silicon; surface treatment; transmission electron microscopy; wear; 1 micron; CO2; FTS process; H2O; SCCO2 process; Si; TEM; air environment; amorphous oxidized silicon wear debris; dominant failure mechanism; fluorinated silane chain process; humidity; humidity effects; humidity levels; microengines; polysilicon micromachines; reliability; rubbing surface wear; supercritical CO2 dried process; surface hydroxide lubricant formation; surface micromachined microengine; surface treatment processes; transmission electron microscopy; wear debris; wear debris rod-like shapes; wear debris spherical shapes; Amorphous materials; Chemical sensors; Electrons; Engines; Failure analysis; Friction; Humidity; Micromechanical devices; Silicon; Surface treatment;
Conference_Titel :
Reliability Physics Symposium Proceedings, 1999. 37th Annual. 1999 IEEE International
Conference_Location :
San Diego, CA
Print_ISBN :
0-7803-5220-3
DOI :
10.1109/RELPHY.1999.761611