Title :
Thermal stresses in L and T shaped metal interconnects: a three dimensional analysis
Author_Institution :
Dept. of Mech. Eng., New Mexico Univ., Albuquerque, NM, USA
Abstract :
Numerical analyses of thermal stresses in L and T shaped aluminum interconnects were carried out using three-dimensional finite element modeling. The evolution of stress and deformation fields in passivated and unpassivated lines with different aspect ratios were quantified. Implications for the design of test interconnect structures for spatially resolved stress measurements and related reliability issues were discussed
Keywords :
aluminium; deformation; finite element analysis; integrated circuit design; integrated circuit interconnections; integrated circuit metallisation; integrated circuit modelling; integrated circuit reliability; integrated circuit testing; stress measurement; thermal stresses; 3D finite element modeling; 3D thermal stress analysis; Al; L shaped metal interconnects; T shaped metal interconnects; aluminum interconnects; deformation field evolution; line aspect ratios; numerical analysis; passivated lines; reliability; spatially resolved stress measurements; stress field evolution; test interconnect structure design; thermal stresses; unpassivated lines; Aluminum; Geometry; Integrated circuit interconnections; Numerical analysis; Spatial resolution; Stress measurement; Tensile stress; Testing; Thermal expansion; Thermal stresses;
Conference_Titel :
Reliability Physics Symposium Proceedings, 1999. 37th Annual. 1999 IEEE International
Conference_Location :
San Diego, CA
Print_ISBN :
0-7803-5220-3
DOI :
10.1109/RELPHY.1999.761627
