DocumentCode

2764794

Title

Design Abstract For Manufacturing Of High Density Wire Bonded VLSI Packages

Author

Guernalec, Jean-yves ; Joly, Jean ; Saint-martin, Xavier

fYear

1993

fDate

9-11 Jun 1993

Firstpage

358

Lastpage

361

Keywords

Assembly; Bonding; Ceramics; Costs; Manufacturing; Packaging machines; Roentgenium; Silicon; Very large scale integration; Wire;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Manufacturing Technology Symposium, 1993., Proceedings of 1993 Japan International

Print_ISBN

0-7803-1432-8

Type

conf

DOI

10.1109/IEMT.1993.639805

Filename

639805