DocumentCode :
2764941
Title :
Low voltage stress-induced-leakage-current in ultrathin gate oxides
Author :
Nicollian, Paul E. ; Rodder, Mark ; Grider, Douglas T. ; Chen, Peijun ; Wallace, Robert M. ; Hattangady, Sunil V.
Author_Institution :
Silicon Technol. Dev., Texas Instrum. Inc., Dallas, TX, USA
fYear :
1999
fDate :
1999
Firstpage :
400
Lastpage :
404
Abstract :
Stress-induced-leakage-current (SILC) is an important concern in ultrathin gate oxides because it may impose constraints on dielectric thickness scaling. We show that for oxides less than ~3.5 nm thick, interfacial traps generated from direct tunneling stress result in a sense voltage dependent SILC mechanism that can dominate the gate leakage current at low operating voltages
Keywords :
CMOS integrated circuits; MOS capacitors; dielectric thin films; electron traps; high field effects; hole traps; integrated circuit testing; interface states; leakage currents; tunnelling; 3.5 nm; CMOS process; MOS capacitors; MOSFET; SILC; SiO2-Si; dielectric thickness scaling; direct tunneling stress; gate leakage current; interfacial traps; low voltage stress-induced-leakage-current; operating voltages; oxide thickness; sense voltage dependent SILC mechanism; ultrathin gate oxides; Anodes; Capacitance-voltage characteristics; DC generators; Degradation; Leakage current; Low voltage; MOS devices; MOSFET circuits; Thermal stresses; Tunneling;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Reliability Physics Symposium Proceedings, 1999. 37th Annual. 1999 IEEE International
Conference_Location :
San Diego, CA
Print_ISBN :
0-7803-5220-3
Type :
conf
DOI :
10.1109/RELPHY.1999.761646
Filename :
761646
Link To Document :
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