Low dielectric constant laminating materials for high-speed computer

Author

Azuma, Keiji

Author_Institution

Sumitomo Bakelite Co. Ltd., Tokyo, Japan

fYear

1989

fDate

26-28 Apr 1989

Firstpage

329

Lastpage

332

Abstract

A prepreg with a low dielectric constant of 2.8 has been developed from polyimide resin and PTFE (polytetrafluoroethylene) cloth. It is established that this prepreg, which features excellent dimensional stability, is easily processed into multilayer PCBs (printed circuit boards) with conventional methods and equipment. Higher processing speed and higher wiring density can be realized with these materials by applying a conventional multilamination process. It is concluded that multilayer PCBs from this prepreg will provide high-performance substrates for high-speed computers

Keywords

composite insulating materials; materials testing; polymers; printed circuits; substrates; PTFE; conventional methods; conventional multilamination process; dimensional stability; high-performance substrates; high-speed computers; low dielectric constant; low permittivity laminating materials; multilayer PCBs; polyimide resin; prepreg; processing speed; wiring density; Dielectric constant; Dielectric materials; Dielectric substrates; Dielectrics and electrical insulation; Erbium; Glass; Polyimides; Resins; Signal processing; Wiring;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Manufacturing Technology Symposium, 1989, Proceedings. Japan IEMT Symposium, Sixth IEEE/CHMT International

Conference_Location

Nara

Type

conf

DOI

10.1109/IEMTS.1989.76168

Filename

76168