Title :
Low dielectric constant laminating materials for high-speed computer
Author_Institution :
Sumitomo Bakelite Co. Ltd., Tokyo, Japan
Abstract :
A prepreg with a low dielectric constant of 2.8 has been developed from polyimide resin and PTFE (polytetrafluoroethylene) cloth. It is established that this prepreg, which features excellent dimensional stability, is easily processed into multilayer PCBs (printed circuit boards) with conventional methods and equipment. Higher processing speed and higher wiring density can be realized with these materials by applying a conventional multilamination process. It is concluded that multilayer PCBs from this prepreg will provide high-performance substrates for high-speed computers
Keywords :
composite insulating materials; materials testing; polymers; printed circuits; substrates; PTFE; conventional methods; conventional multilamination process; dimensional stability; high-performance substrates; high-speed computers; low dielectric constant; low permittivity laminating materials; multilayer PCBs; polyimide resin; prepreg; processing speed; wiring density; Dielectric constant; Dielectric materials; Dielectric substrates; Dielectrics and electrical insulation; Erbium; Glass; Polyimides; Resins; Signal processing; Wiring;
Conference_Titel :
Electronic Manufacturing Technology Symposium, 1989, Proceedings. Japan IEMT Symposium, Sixth IEEE/CHMT International
Conference_Location :
Nara
DOI :
10.1109/IEMTS.1989.76168
