A Stud-bump-bonding Technique For High Density Multi-chip-module

Author

Bessho, Yoshihiro ; Tomura, Yoshihiro ; Hakotani, Yasuhiko ; Tsukamoto, Masahide ; Ishlda, T. ; Omoya, Kazunori

fYear

1993

fDate

9-11 Jun 1993

Firstpage

362

Lastpage

365

Keywords

Artificial intelligence; Bonding; Ceramics; Conductive adhesives; Electrodes; Gold; Large scale integration; Packaging; Stress; Wire;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Manufacturing Technology Symposium, 1993., Proceedings of 1993 Japan International

Print_ISBN

0-7803-1432-8

Type

DOI

10.1109/IEMT.1993.639807

Filename

639807

Link To Document