Metallurgical reaction in soldered thick films

Summary form only given, as follows. Pb/Sn solder and Pd/Ag thick-film conductor joints are formed by dipping and reflowing. The microstructure of the joints is investigated with emphasis on the metallurgical reaction between the solder and the thick-film materials. The morphology of the fracture surface in the conductor-solder interface after tensile test is evaluated by means of an electron microscope. The nature of the metallurgical reaction at the joint interface, the elemental redistribution around the fracture surface, and the formation of the intermetallic compound after aging and/or thermal cycling test are discussed