• DocumentCode
    2765335
  • Title

    Selective self-assembly of nanoparticles on trench sidewalls and its relationship with scallop nanostructure

  • Author

    Abasaki, M. ; Souma, S. ; Takeda, M. ; Moronuki, N. ; Sugiyama, M.

  • Author_Institution
    3D BEANS Center, BEANS Project, Tokyo, Japan
  • fYear
    2011
  • fDate
    23-27 Jan. 2011
  • Firstpage
    41
  • Lastpage
    44
  • Abstract
    Self-assembly of colloidal particles has an advantage of low cost, high productivity and applicability to various devices. The capability of assembling nano-scale particles on three dimensional structures can extend the fields of application, such as high-sensitivity gas sensors and bioassay devices with surface-functionalized particles. We demonstrate such assembly where monolayer polystyrene particles were assembled only on the sidewall of trenches etched on a silicon wafer. Moreover, it was found that the assembly structure can be controlled by the scallops when its periodicity is nearly the same as the particle diameter.
  • Keywords
    colloids; micromechanical devices; nanoelectronics; nanoparticles; self-assembly; silicon; assembly structure; bioassay devices; colloidal particles; high-sensitivity gas sensors; monolayer polystyrene particles; nanoparticles; nanoscale particle assembly; scallop nanostructure; selective self-assembly; silicon wafer; surface-functionalized particles; three dimensional structures; trench sidewalls; Assembly; Force; Self-assembly; Substrates; Surface tension; Surface treatment; Suspensions;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro Electro Mechanical Systems (MEMS), 2011 IEEE 24th International Conference on
  • Conference_Location
    Cancun
  • ISSN
    1084-6999
  • Print_ISBN
    978-1-4244-9632-7
  • Type

    conf

  • DOI
    10.1109/MEMSYS.2011.5734357
  • Filename
    5734357