DocumentCode
2765335
Title
Selective self-assembly of nanoparticles on trench sidewalls and its relationship with scallop nanostructure
Author
Abasaki, M. ; Souma, S. ; Takeda, M. ; Moronuki, N. ; Sugiyama, M.
Author_Institution
3D BEANS Center, BEANS Project, Tokyo, Japan
fYear
2011
fDate
23-27 Jan. 2011
Firstpage
41
Lastpage
44
Abstract
Self-assembly of colloidal particles has an advantage of low cost, high productivity and applicability to various devices. The capability of assembling nano-scale particles on three dimensional structures can extend the fields of application, such as high-sensitivity gas sensors and bioassay devices with surface-functionalized particles. We demonstrate such assembly where monolayer polystyrene particles were assembled only on the sidewall of trenches etched on a silicon wafer. Moreover, it was found that the assembly structure can be controlled by the scallops when its periodicity is nearly the same as the particle diameter.
Keywords
colloids; micromechanical devices; nanoelectronics; nanoparticles; self-assembly; silicon; assembly structure; bioassay devices; colloidal particles; high-sensitivity gas sensors; monolayer polystyrene particles; nanoparticles; nanoscale particle assembly; scallop nanostructure; selective self-assembly; silicon wafer; surface-functionalized particles; three dimensional structures; trench sidewalls; Assembly; Force; Self-assembly; Substrates; Surface tension; Surface treatment; Suspensions;
fLanguage
English
Publisher
ieee
Conference_Titel
Micro Electro Mechanical Systems (MEMS), 2011 IEEE 24th International Conference on
Conference_Location
Cancun
ISSN
1084-6999
Print_ISBN
978-1-4244-9632-7
Type
conf
DOI
10.1109/MEMSYS.2011.5734357
Filename
5734357
Link To Document