Title :
Low temperature conformal silicon dioxide deposition using supercritical fluid for polymer-based MEMS
Author :
Yamada, H. ; Momose, T. ; Kitamura, Y. ; Hattori, Y. ; Shimogaki, Y. ; Sugiyama, M.
Author_Institution :
3D BEANS Center, BEANS Project, Tokyo, Japan
Abstract :
A novel supercritical fluid deposition method (SCFD) of SiO2 has been developed for polymer-based MEMS. In order to reduce deposition temperature for the application to polymer-based MEMS process, we selected O3 as an oxidant in SiO2-SCFD. Conformal SiO2 deposition on Si trenches (aspect ratio 24) at low temperatures (below 200°C) was achieved, which were acceptable for deposition on polymers. In addition, SiO2 coating on inner wall surface of microchannels, which was made of polydimethylsiloxane (PDMS), was demonstrated.
Keywords :
micromechanical devices; polymers; silicon compounds; PDMS; SCFD; SiO2; deposition temperature reduction; low temperature conformal silicon dioxide deposition; microchannels; polydimethylsiloxane; polymer-based MEMS process; supercritical fluid deposition method; Coatings; Films; Inductors; Microchannel; Silicon; Substrates; Surface treatment;
Conference_Titel :
Micro Electro Mechanical Systems (MEMS), 2011 IEEE 24th International Conference on
Conference_Location :
Cancun
Print_ISBN :
978-1-4244-9632-7
DOI :
10.1109/MEMSYS.2011.5734359
