Title :
Sixth IEEE/CHMT International Electronic Manufacturing Technology Symposium. Proceedings 1989 Japan IEMT Symposium (Cat. No.89CH2741-7)
Abstract :
The following topics are dealt with: substrates; packaging technology; components; fabrication processes; sensors; manufacturing; inorganic materials; measurement and evaluation; design and analysis; organic materials; and reliability
Keywords :
detectors; electronic equipment manufacture; integrated circuit manufacture; manufacture; materials; packaging; printed circuit manufacture; production; reliability; semiconductor device manufacture; substrates; testing; analysis methods; components; design methods; fabrication processes; inorganic materials; manufacturing; measurement; organic materials; packaging technology; reliability; sensors; substrates; testing;
Conference_Titel :
Electronic Manufacturing Technology Symposium, 1989, Proceedings. Japan IEMT Symposium, Sixth IEEE/CHMT International
Conference_Location :
Nara, Japan
DOI :
10.1109/IEMTS.1989.76176
