A Low Cost Multi-chip Module Using Fine Line Thick Film And Solder Ball Bump Interconnection Methods

Author

Segawa, Masao ; Saito, Yasuhito ; Ogashiwa, Toshinori ; Akimoto, Hideyuki

fYear

1993

fDate

9-11 Jun 1993

Firstpage

370

Lastpage

373

Keywords

Aluminum; Bonding forces; Bonding processes; Costs; Electrodes; Integrated circuit interconnections; Production; Thick films; Tin; Wire;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Manufacturing Technology Symposium, 1993., Proceedings of 1993 Japan International

Print_ISBN

0-7803-1432-8

Type

DOI

10.1109/IEMT.1993.639810

Filename

639810

Link To Document