Assembling technique of three dimensional microstructures using clip mechanism of microspring

In this paper, a microassembling technique of microstructures using a silicon clip mechanism is developed for a time-of-flight scanning force microscope (TOF-SFM) probe. Microsprings formed by deep reactive ion etching were used as a clip micromechanism. Microelements are manipulated by a manipulator, and microgap between the microspring and opposite wall is expanded by pulling the microspring using a microneedle. Then the microelement is inserted into the micromechanism, and clipped by releasing the microspring. After assembling, all microelements are fixed with conductive glue. This technique is advantageous to fabricate complex three-dimensional microstructures. We demonstrate the assembling of a microelectrode and microcantilever for TOF-SFM probe.