Electro-thermal simulation of semiconductor devices and hybrid circuits

Author

Menozzi, R. ; De Iaco, E. ; Sozzi, G. ; Cova, P. ; Delmonte, N. ; Zampardi, P. ; Kwok, K. ; Cismaru, C. ; Metzger, A.

Author_Institution

Univ. of Parma, Parma

fYear

2006

fDate

6-8 Dec. 2006

Firstpage

1

Lastpage

6

Abstract

This works describes the use of electro-thermal numerical simulations for the design, modeling, and reliability evaluation of semiconductor devices and electronic circuits. Examples at the device level focus on 2D and 3D simulations of GaAs-based HFETs and HBTs, while a case study of hybrid high-power DC/DC converters is shown to illustrate the possibilities and challenges of thermal simulation at board level.

Keywords

DC-DC power convertors; heterojunction bipolar transistors; high electron mobility transistors; semiconductor device models; semiconductor device reliability; HBT; HFET; electro-thermal simulation; hybrid circuits; hybrid high-power DC-DC converters; semiconductor devices design; semiconductor devices modeling; semiconductor devices reliability; Circuit simulation; DC-DC power converters; Equations; HEMTs; Heat sinks; MODFETs; Numerical models; Semiconductor devices; Temperature; Thermal resistance; HBTs, HFETs, DC/DC converters; Thermal modeling; numerical simulations;

fLanguage

English

Publisher

ieee

Conference_Titel

Optoelectronic and Microelectronic Materials and Devices, 2006 Conference on

Conference_Location

Perth, WA

Print_ISBN

978-1-4244-0578-7

Electronic_ISBN

978-1-4244-0578-7

Type

conf

DOI

10.1109/COMMAD.2006.4429863

Filename

4429863